MSK LED packaging adhesive series products

Usage:
1. Mix A, B and phosphor powder in proportion until there are no lumps and lumps. After the consistency is uniform, completely defoaming under vacuum< Br/>2. Pour the rubber into the needle barrel for glue filling, and put the needle barrel with the rubber into the vacuum for bubble drainage again< Br/>3. Before glue filling, preheat the support or base to remove moisture, so as to avoid bubbles during curing< Br/>4. Finally, two stages of baking are carried out. First, the initial curing reaction is carried out at low temperature, and then the curing is completed at high temperature.

DATA SHEET

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MSDS

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Test Report

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Certification

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  • LED封装胶系列 Product description

产品特性

     ·超低的透气性

     ·超强的抗硫磺性                     

     ·与不同基材优异的粘接力力

     · 耐冷热冲击性能优异

     ·良好的耐温性

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