MSK silicone flame-retardant heat conductive potting adhesive MR6619-1.0AB

MR6619 is a high thermal conductivity silicone electronic potting adhesive with good thermal conductivity and excellent flow performance. It has low viscosity before curing. After mixing the two components, it can be cured at room temperature or at elevated temperature. The higher the temperature is, the faster the curing is, and the material will not shrink during curing. This product can effectively prevent the invasion of moisture, dust and harmful gases into electronic components by encapsulating electronic components, reduce vibration, prevent external force damage and stabilize the parameters of components, and minimize the adverse impact of the outside world. At the same time, the application of thermal conductive materials can effectively diffuse the heat generated by the circuit, prevent the heat concentration of the circuit and the temperature rise, thus extending the service life of electronic devices