MR6619A/B two-component silicone potting adhesive

MR6619A/B two-component silicone potting adhesive is a kind of thermal conductive silicone electronic potting adhesive with good thermal conductivity and excellent flow performance. It has low viscosity before curing. After mixing the two components, it can be cured at room temperature, and curing can be accelerated by heating up; No shrinkage of the material during curing. This product can effectively prevent the invasion of moisture, dust and harmful gases into electronic components by encapsulating electronic components, reduce vibration, prevent external force damage and stabilize the parameters of components, and minimize the adverse impact of the outside world. At the same time, the application of thermal conductive materials can effectively diffuse the heat generated by the circuit, prevent the heat concentration of the circuit and the temperature rise, thus extending the service life of electronic devices.