MR2341AB high thermal conductivity silicone potting adhesive is a kind of room temperature/heating curing additive silicone material. This two-component elastic silica gel is designed to encapsulate and protect electronic products under severe conditions< Br/>MR2341AB high thermal conductivity silicone potting adhesive uses a new technology, which can cure well without heating. When used, after thoroughly mixing components A and B in the proportion of 1:1 (weight ratio or volume ratio), the product will solidify in a certain time to form an elastic buffer material.
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固化后的弹性体具有以下特性:
·抵抗湿气、污物和其它大气组分
·减轻机械、热冲击和震动引起的机械应力和张力
·容易修补
·高频电气性能好
·无溶剂,无固化副产物
·在-50-250℃间稳定的机械和电气性能
·优异的阻燃性